Micro-LEDs are grown on a support substrate utilizing techniques such as Metallo-Organic Chemical Vapor Deposition (MOCVD) among others. In an example, the method is useful in general LED device transfer and placement and is particularly useful for mass-transfer of micro-LED (uLED) devices that can be as small as a few microns on a side. More particularly, embodiments of the invention relate to techniques, including methods and apparatus to efficiently transfer a plurality of Light Emitting Diode (LED) devices from a source surface to a target surface during the manufacturing process. The present invention relates to light emitting diode (LED) devices. 13, 2018, the contents of which are incorporated by reference herein. This application is a nonprovisional of U.S.
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